Release time：2024-01-18
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Future development direction of inductors
Among the three major passive components, the chip based development of inductors is the slowest. Moreover, due to the limited application of inductors in integrated circuits, the vitality of inductors is more enduring in the process of integrating discrete devices. Even in Japan, the conversion rate of inductors is only over 50%. The reason is that it is difficult for micro inductors to achieve sufficient inductance and quality factor (Q), and the manufacturing process is complex due to the interweaving of circuits and magnetic circuits in magnetic components. Inductors will face the following development directions in the future:
Miniaturization: TDK and other companies have started producing products in size 0402, with a volume reduction of 70% compared to 0603, which is more in line with the miniaturization characteristics of terminal products and also saves more raw materials.
High sensitivity: Previously, high sensitivity inductors were traditional inductors. With the improvement of molding technology and magnetic powder material technology, the inductance range of chip inductors continues to increase, resulting in huge market demand.
High power: The improvement of functions and ultra-thin appearance of portable products such as smartphones require higher power chip inductors, which have been produced by companies such as TDK and SUNGSUM and have been widely used in Samsung and LG smartphones,
High frequency: For communication quality and transmission distance requirements, high-frequency chip inductors have a wide space. At present, the self resonant frequency of high-frequency chip inductors in the industry has generally exceeded 3GHz and is developing towards 10GHz. High stability and precision: The accuracy of ferrite multilayer chip inductors can only reach ± 10%, and the welding heat resistance rate is generally above 20%. If it can be controlled within 5%, it can replace wire wound inductors on a large scale.
In addition, the integration of passive components has become an important trend in the development of passive components, and it is also the electronic information technology with the strongest market demand in the future. It is expected that a considerable number of passive electronic components will be integrated in the next 10 years. Among them, LTCC (Low Temperature Co fired Ceramics) technology is the mainstream technology for passive integration, which is also one of the technologies in the Shunluo acquisition of South Glass Electronics. In 1997, the LTCC market sales were only around 300 million US dollars; By 2000, it will reach 1.2 billion US dollars; It is predicted that the sales volume of LTCC in the Chinese Mainland market will reach US $3 billion by 2010.
LTCC definition: This technology is to make low-temperature sintered ceramic powder into precisely thick and dense ceramic strips, and use laser drilling, micro hole grouting, precision conductor slurry printing and other processes to produce the required circuit graphics on the ceramic strips. Multiple passive components are buried in them, then stacked together and sintered at 900 ℃ to produce passive integrated components for three-dimensional circuit networks. It can also be made into three-dimensional circuit substrates with built-in passive components, IC and active devices can be mounted on its surface to create passive/active integrated functional modules.
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